Micron Memory Module Part Number Decoder Guide

This reference covers standard volatile DDR5 and DDR4 SDRAM modules, plus supported DDR2 module structures. It follows the DDR5 module page revised 22 August 2023, the DDR4 page revised 6 April 2022 and the DDR2 page revised 27 November 2018 inside Micron’s current official guide. DDR4 NVDIMM is outside this phase. Revision values remain not decoded.

Open the interactive memory part number decoder.

DDR5 module grammar

MT C [die count] [F/C] [package ranks] [logical ranks] [x4/x8/x16] [density] [height] [die-in-package] [type] [temperature] [speed] [revision suffix]

Position	Possible values	Meaning
1	MT	Micron Technology manufacturer identifier
2	C	DDR5 SDRAM module product family
3	Numeric	Number of DRAM die
4	F, C	Module voltage-class code; the guide identifies the applicable module types
5	1, 2, 3, 4, 8	Number of package ranks
6	0, 2, 4, 8, 16	Logical ranks for 3DS or WB modules
7	4, 8, 16	DRAM component configuration
8	3, Z, 4, Y, 5, X, 6, W, 7, V, 8, 9, A, B, C	Published module density
9	S, D, H, L	Module height
10	1, 2, 4, 8	Die-in-package arrangement
11	S, V, T, W, U, A, E, B, R, P	Module type, pin count and module data width
12	C, I, B	Package temperature capability
13	32B, 36B, 40B, 44B, 48B, 52B, 56B, 60B, 64B, 68B, 72B, 76B, 80B, 88B	Module speed bin, PC5 grade, clock, data rate and timing tuple
14	Alphanumeric	Die revision, called part-mark designator by Micron; value-specific meanings are not published
15	Alphanumeric	PCB revision: numeric for production and alpha for engineering sample
16 (optional)	R, T	Final pack type for CPG distribution parts only

DDR4 module grammar

MT A 18 A SF 4G72 P Z - 3G2 F 1 [T]

Position	Possible values	Meaning
1	MT; CC is internal only and is not enabled	MT = Micron Technology; Micron lists CC for Crucial & Components internal use
2	A	DDR4 SDRAM module product family
3	Numeric	Number of DRAM die
4	A	1.2 V module voltage
5	TF, TS, TQ, SF, SS, SQ, SE, DF, DS, DQ, LF, LS, LQ, LE, HF, HS, HQ, HE, SZF, SZS, SZQ, SZE, DZF, DZS, DZQ	Module option and physical construction
6	Depth + width; G means gigabits, blank means megabits	Module configuration, for example 4G72 = 4 Gig x72
7	A, H, L, LS, P, PS, AK, PK, N, X	Module type and pin/form-factor code
8	Z, DZ, IZ, BZ, DBZ	Package, operating-temperature and rank-range code
9	2G1, 2S1, 2G3, 2G4, 2S3, 2S4, 2G6, 2S6, 2G7, 2G9, 2S9, 3G2, 3S2	Module speed grade and SPD timing tuple (CL-tRCD-tRP)
10	Up to two alphanumeric characters	Die revision position; Micron family datasheets describe the final pair as component and PCB revisions
11	One alphanumeric character	Printed-circuit-board revision designator
12 (optional)	R, T	Final pack type for CPG distribution parts only

DDR2 module grammar

MT 18 H TF 25672 A Z - 80E M 1 [D 6 for FBDIMM only]

Position	Possible values	Meaning
1	MT	Micron Technology manufacturer identifier
2	Numeric	Number of DRAM die
3	H, G, R	Module voltage: H = 1.8 V, G = 1.5 V, R = 1.55 V
4	TF, TS, TZS, VF, VS, VZS	Module option and physical construction
5	Depth + width; G means gigabits, blank means megabits	Module configuration, for example 25672 = 256 Meg x72
6	(blank), A, F, H, P, PK, RH	Module type and pin/form-factor code
7	Y, Z, DY, DZ, IY, TY, IZ, TZ	Package, operating-temperature and rank-range code
8	40E, 53E, 667, 80E, 800, 1GA	Module speed grade and SPD timing tuple (CL-tRCD-tRP)
9	One or two alphanumeric characters	Die revision position; Micron family datasheets call this a component revision and direct users to consult the factory for current codes
10	One alphanumeric character	Printed-circuit-board revision designator
11 (FBDIMM only)	E, D, N	Advanced Memory Buffer vendor
12 (FBDIMM only)	One alphanumeric character	Advanced Memory Buffer vendor revision

Worked example: MTC10F1084S1RC48BA1

16GB DDR5-4800 RDIMM 1 package rank

Segment	Position	Meaning
`MT`	Manufacturer	Micron Technology
`C`	Product family	DDR5 SDRAM module
`10`	Number of DRAM die	Structurally extracted numeric die-count field: 10. Micron's guide identifies this field but does not publish a universal allowed-value table.
`F`	Voltage code	RDIMM voltage code
`1`	Package ranks	1 package rank
`0`	Logical ranks	No logical ranks
`8`	Component configuration	x8 DRAM component configuration
`4`	Module density	16GB module density
`S`	Module height	LP module height
`1`	Die-in-package	Single-die package
`R`	Module type	288-pin or 287-pin RDIMM x80
`C`	Package temperature capability	Commercial temperature capability
`48B`	Speed grade	DDR5-4800B, PC5-4800, 2400 MHz, 4800 MT/s, 40-39-39
`A1`	Revision suffix	Not decoded: A1 contains Micron's die revision and PCB revision positions, with a possible optional final-pack field. The cited guide does not publish a value-specific decoder or an unambiguous universal split for this suffix.

Micron product documentation for MTC10F1084S1RC48BA1

Worked example: MTA18ASF4G72PZ-3G2F1

32GB DDR4-3200 RDIMM ECC 1Rx4 1.2V

Segment	Position	Meaning
`MT`	Manufacturer	Micron Technology
`A`	Product family	DDR4 SDRAM module
`18`	DRAM die count	18 DRAM die
`A`	Voltage	1.2 V
`SF`	Module option	FBGA with temperature sensor
`4G72`	Module configuration	4 Gig x72 module configuration
`P`	Module type	288-pin RDIMM
`Z`	Package code	288-pin halogen-free DIMM
`(blank)`	Temperature range marking	Commercial operating range 0°C to 95°C; Micron's family datasheet specifies no temperature marking
`3G2`	Speed grade	DDR4-3200, PC4-3200, SPD 22-22-22 (CL-tRCD-tRP)
`F`	Die / component revision	Not decoded: F occupies Micron's die or component revision position, but its value-specific meaning is not published in the cited documents.
`1`	PCB revision	Not decoded: 1 occupies Micron's printed-circuit-board revision position, but its value-specific meaning is not published in the cited documents.

Micron product documentation for MTA18ASF4G72PZ-3G2F1

Worked example: MTA9ASF1G72AZ-3G2R1

8GB DDR4-3200 UDIMM ECC 1Rx8 1.2V

Segment	Position	Meaning
`MT`	Manufacturer	Micron Technology
`A`	Product family	DDR4 SDRAM module
`9`	DRAM die count	9 DRAM die
`A`	Voltage	1.2 V
`SF`	Module option	FBGA with temperature sensor
`1G72`	Module configuration	1 Gig x72 module configuration
`A`	Module type	288-pin UDIMM (unbuffered)
`Z`	Package code	288-pin halogen-free DIMM
`(blank)`	Temperature range marking	Commercial operating range 0°C to 95°C; Micron's family datasheet specifies no temperature marking
`3G2`	Speed grade	DDR4-3200, PC4-3200, SPD 22-22-22 (CL-tRCD-tRP)
`R`	Die / component revision	Not decoded: R occupies Micron's die or component revision position, but its value-specific meaning is not published in the cited documents.
`1`	PCB revision	Not decoded: 1 occupies Micron's printed-circuit-board revision position, but its value-specific meaning is not published in the cited documents.

Micron product documentation for MTA9ASF1G72AZ-3G2R1

Worked example: MT18HTF25672AZ-80EM1

2GB DDR2-800 UDIMM ECC 2Rx8 1.8V

Segment	Position	Meaning
`MT`	Manufacturer	Micron Technology
`18`	DRAM die count	18 DRAM die
`H`	Voltage	1.8 V
`TF`	Module option	FBGA
`25672`	Module configuration	256 Meg x72 module configuration
`A`	Module type	240-pin UDIMM (unbuffered)
`Z`	Package code	Commercial operating temperature; 240-pin halogen-free DIMM
`80E`	Speed grade	DDR2-800, PC2-6400, SPD 5-5-5 (CL-tRCD-tRP)
`M`	Die / component revision	Not decoded: M occupies Micron's die or component revision position, but its value-specific meaning is not published in the cited documents.
`1`	PCB revision	Not decoded: 1 occupies Micron's printed-circuit-board revision position, but its value-specific meaning is not published in the cited documents.

Micron product documentation for MT18HTF25672AZ-80EM1